<
General Metrology

Wafer Thickness Measurement System

Watch video on

Angle Systems' Wafer Thickness Measurement System is designed to rapidly measure thickness on an array of wafers. This is accomplished by differential measurement two laser triangulation sensors. The system uses interchangeable trays so that wafers of variable diameters can be measured. Programmable recipes are used such that wafers with different dimensions and measurement parameters can be inspected. The system takes more than several data points (user defined) at various locations in order to determine the thickness of the wafer. The number of points used for the measurement can be varied by changing the number of scan lines. The numerical results are displayed alongside a map that identifies wafers to be in or out of tolerances. Individual wafer plots showing curvature can be used to identify and correct problems that might be occurring in the manufacturing process.

Specifications

  • Wafer Diameter: 15mm to 300mm
  • Wafer Type: Opaque and Reflective
  • Sensor type: Laser Triangulation (2)
  • Sensor Resolution: 0.001 µm to 2.0 µm
  • Scanning Speed: Variable with number of points
  • Data Analysis:
    • Mean wafer thickness
    • 3D map of individual wafers showing surface
    • Pass/Fail based on specification
  • Supported Sensors: Laser Triangulation, Confocal, Capacitance

Software Main Features

  • Customizable recipes based on wafer specifications
  • Individual wafer 3D map
  • Mean wafer thickness
  • Easy to identify pass or fail based on predefined tolerances
  • Results storage based on wafer type
  • Self calibration of system using NIST traceable gauge block.
  • Statistical Analysis as required by customer (Optional)
  • Any other feature can be incorporated based on application needs (Optional)

3D Laser Scanning System

Watch video on

Angle Systems' 3D Laser Scanning System is based on scanning of objects using Laser Triangulation/Con-focal sensors. The X & Y axes are motorized with a travel ranges of up to 250mm and the Z axis can either be manual or motorized based on the specific application requirements. The system provides a 3D map of the object along with measurements of thickness, height and flatness depending on the type of application.

Specifications

  • X-axis Travel: 25 mm to 250 mm (motorized)
  • Y-axis Travel: 25 mm to 250 mm (motorized)
  • Z-axis Travel: 50 mm (manual)
  • X-Y Positioning Resolution: 0.1 µm to 1 µm
  • Maximum Depth Measurement: 25 mm
  • Sensor Resolution: 0.001 µm to 2 µm
  • Sensor Type: Laser Triangulation/Confocal
  • Typical Scanning Speed (40 µm interval): 40 mm/sec

Software Main Features

  • 3D map of object
  • 2D profiles of individual line scans
  • Thickness, height and flatness measurements based on application
  • Statistical Analysis as required by customer (optional)
  • Any other feature can be incorporated based on application needs (optional)

© 2013 Angle Systems LLC. All Rights Reserved. | Contact Webmaster